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WHAT'S NEW at APC?

Artistic Plating to once again Exhibit at 2012 Medical Design and Manufacturing Show in Anaheim, CA – Artistic Plating will be exhibiting in booth 3083 at the upcoming 2012 MD&M West show in Anaheim, CA February 14th-16th 2012….

Tacti-Black Black Electroless Nickel
Looking for a consistent black finish with the corrosion protection, hardness, lubricity and perfect deposit uniformity of electroless nickel?  Look no further than Artistic Plating’s new Tacti-Black Electroless Nickel….

High Purity Silver
Due to sustained growth and demand within the Power Transmission and Defense sectors, Artistic Plating has expanded existing silver plating services with the addition of a full production capacity, high-purity, Type I matte silver plating bath.  This bath conforms to ASTM B700, Type I, Grade A as well as AMS 2410, AMS 2411 and AMS 2412 specifications…

Heavy Build Copper
Coming Fall 2011!  Artistic Plating’s newest state-of-the-art plating line will offer expanded capacity in high-speed, heavy-build copper plating services within the ammunition, defense and HVAC industries.  Thicknesses of over 0.020” per side are attainable on nearly any substrate with this exciting expansion…

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Hydrogen Embrittlement And Baking

What is hydrogen embrittlement and how is it prevented?

Hydrogen embrittlement results from the simultaneous codeposition of the primary metal and hydrogen on the surface of the work piece (cathode). The hydrogen is available from the water in aqueous plating bath chemistries. Because the hydrogen atom is much smaller in size than the metal of the deposit, it is able to migrate into the crystal lattice of the basis metal, and reside interstitially between the individual metal atoms. The interstitial hydrogen can greatly amplify the stress of applied forces within the basis metal which can produce catastrophic fracture at loadings much lower than the typical yield strength of the material. Hardened steels (> 40 Rc) are particularly susceptible to this phenomena and as such are generally required to be baked after plating to protect against hydrogen embrittlement.

Hydrogen codeposition can occur in the plating process either during the actual electrolytic deposition or during the cleaning and acid pickles preceding the plating bath. It is readily removed from the metal lattice by baking the product immediately after plating. The requirement for baking is a time-at-temperature cycle that is generally specified on the part print or within a plating specification.  A typical cycle is to bake at 375ºF for 4 hours within 1 hour after plating.

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